The C-Tack Desktop System developed by C- Tech Systems for ACF Laminating (Pre- Tacking) applications. It uses pneumatic bonding head technology and offers reliable process control, with an integrated Constant Heat power supply. ACF (Anisotropic Conductive Film) Laminating is a Hot Bar bonding technique to make electrical bonds between flexible and rigid circuit boards, glass panel displays and flex foils. ACFs are widely used to perform LCD-to- flex, flex-to-board or flex-to-flex connections. The ACF Laminating/Pre-Tacking process forms the first part of the total bonding process: applying the adhesive material to the substrate. After that

the final Heat Seal Bonding process can take place. Before the ACF is applied to the substrate, the ACF tape is half-cut at the required length from a reel of ACF.