C-Flow Controller

Stand-alone Pulsed Heat Controller with touch screen

The C-Flow Bonding systems stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control, all packaged into an easy to use, multi-language, touch screen interface

The C-Flow Bonding systems stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control, all packaged into an easy to use, multi-language, touch screen interface. Whether you require a system for Heat-Seal Bonding, Reflow soldering, ACF Laminating, Heat-Staking, or other demanding application, the C-Flow can get the job done. The C-Flow was designed from the ground up for easy stand-alone applications and complete factory integration with RS-485, compact size, and external I/O.

The C-Flow is a revolutionary concept in intelligent pulsed heat controllers. The C-Flow is an industry first, by combining precision temperature control with micron level displacement monitoring and real time control of thermode pressure, providing its users with capabilities usually requiring multiple pieces of equipment.

Features

• Temperature and force control
• Displacement monitoring
• Multi-language user-friendly touchscreen interface
• RS-485
• External I/O

Functions

• 15 heating profiles (with 20 storage options for temperature, time and force, each)
• Process control limited including peak and average values
• Data output to PC (via RS-485)
• Process alarms and counters
• Easily integrated into production line

Applications

• Heat-Seal Bonding
• Reflow soldering
• ACF laminating
• Heat-Staking